Tin Whiskers – A Survey of the State of the Art
Tin whiskers “growing” out of Tin plated assemblies have plagued the electronics industry for decades, their cause unknown. The resulting short circuit failures are sometimes spectacularly bad.
Tin-Lead solder, which did not have the issue, has been eliminated by ROHS compliance. Initially lead was eliminated in Europe and by default everywhere else. This has resulted in pure Tin plating condition developing on many formerly benign electronic component terminations – often without notice to users!
Today, a root-cause has perhaps been identified, finally allowing design and manufacturing engineers to mitigate - and possibly even eliminate - them forever. Kevin VanZuilen, a local failure analysis engineer, will survey the state-of-the-art in this interesting and historically frustrating field
Costs: None
Email Chairperson@ieeefortwayne.org to register
Date:
Time:
Location:
7:00 PM
Indiana Institute of Technology
Zollner Building Room Z101